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    • Thermal control of an antenna power unit for radio frequency application

    Paper number

    IAC-09.C2.8.6

    Author

    Mr. Riccardo Monti, University of Rome "La Sapienza", Italy

    Coauthor

    Prof. Paolo Gasbarri, Università di Roma "La Sapienza", Italy

    Coauthor

    Prof. Renato Barboni, University of Rome "La Sapienza", Italy

    Coauthor

    Dr. Umberto Lecci, Thales Alenia Space Italia, Italy

    Year

    2009

    Abstract
    One of the most important issues of the microelectronic research and
design is the thermal control. 
The high level of integration of these components must take  a thermal control design
into account  
specially when this technology is coupled with the hybrid materials one. The high capability and 
the high efficiency of these elements is directly correlated to the thermal problem because as the 
power requested by the electronic devices increases also the internal temperature to be dissipated 
increases. 

Actually the standards design rules, such as the MIL STD 833G, foresee many limits for 
these electronic components, 
some of them are related to the minimum and maximum operative temperatures 
and they must not be  exceeded in order to preserve the functionality during the operative life.

In order to respect these design rules and to decrease the power dissipation by the 
Joule effect 
a new technological solution is proposed and studied in this paper. 
The idea is to have a thermal 
control by using thermal piping, by exploiting the pyroelectric effects of 
the material used for 
the packaging of the microelectronic devices. 
In particular the electronic components are installed 
on a surface of a pyroelectric material. This kind of material is able to convert the temperature, 
or a thermal flux, in an electrical charge spontaneously; that the charge is 
obtained it can be 
stored in a dedicated capacitor electrically attached to the surface.

The use of this kind of material is based on a constant thermal gradient to assure the flux of 
the electrical charge. In order to know the dynamic behavior of this device a thermo-elastic analysis 
is performed. 
In this paper the thermo-elastic analysis, the numerical solution of the non-stationary 
thermal problem and many different operative conditions are presented. The problem involves the study 
of a power unit, a HPA (High Power Amplifier), 
installed on a T/R (Transmission and Receive) module 
used in the RF (Radio Frequency) applications for a satellite antenna. It is possible to recognize the circuits 
printed on the support in the middle and the two power 
units placed at the left and right end of the 
component.
    Abstract document

    IAC-09.C2.8.6.pdf

    Manuscript document

    IAC-09.C2.8.6.pdf (🔒 authorized access only).

    To get the manuscript, please contact IAF Secretariat.