Development of Low CTE CFRP Faceskin Heat Pipe Embedded Honeycomb Sandwich Panel
- Paper number
IAC-04-I.1.02
- Author
Mr. Hidetaka Ishii, Mitsubishi Electric Corporation, Japan
- Year
2004
- Abstract document
- Manuscript document
IAC-04-I.1.02.pdf (🔒 authorized access only).
To get the manuscript, please contact IAF Secretariat.