• Home
  • Current congress
  • Public Website
  • My papers
  • root
  • browse
  • IAC-06
  • A2
  • 5
  • paper
  • Materials Research Conducted Aboard the International Space Station: Facilities Overview, Operational Procedures, and Experimental Outcomes

    Paper number

    IAC-06-A2.5.01

    Author

    Dr. Richard Grugel, National Aeronautics and Space Administration (NASA)/Marshall Space Flight Center, United States

    Coauthor

    Mr. Paul Luz, National Aeronautics and Space Administration (NASA)/Marshall Space Flight Center, United States

    Coauthor

    Mr. Guy Smith, University of Alabama in Huntsville, United States

    Coauthor

    Mr. Reggie Spivey, United States

    Coauthor

    Ms. Linda Jeter, National Aeronautics and Space Administration (NASA)/Marshall Space Flight Center, United States

    Coauthor

    Dr. Donald Gillies, National Aeronautics and Space Administration (NASA)/Marshall Space Flight Center, United States

    Coauthor

    Dr. Fay Hua, United States

    Coauthor

    Dr. A. Anilkumar, United States

    Year

    2006

    Abstract
    The Microgravity Science Glovebox (MSG) and Maintenance Work Area (MWA) are facilities aboard the International Space Station (ISS) that were used to successfully conduct experiments in support of, respectively, the Pore Formation and Mobility Investigation (PFMI) and the In-Space Soldering Investigation (ISSI).  The capabilities of these facilities are briefly discussed and then demonstrated by presenting “real-time” and subsequently down-linked video-taped examples from the abovementioned experiments.  Data interpretation, ISS telescience, some lessons learned, and the need of such facilities for conducting work in support of understanding materials behavior, particularly fluid processing and transport scenarios, in low-gravity environments is discussed.
    Abstract document

    IAC-06-A2.5.01.pdf

    Manuscript document

    IAC-06-A2.5.01.pdf (🔒 authorized access only).

    To get the manuscript, please contact IAF Secretariat.