Multifunctional structures using high thermal conductivity fibres
- Paper number
IAC-06-C2.8.10
- Author
Ms. Garbiñe Atxaga, INASMET-TECNALIA, Spain
- Coauthor
Mr. Jesús Marcos, INASMET-TECNALIA, Spain
- Coauthor
Mr. Miguel Segura, INASMET-TECNALIA, Spain
- Coauthor
Dr. Aitor Landaberea, INASMET-TECNALIA, Spain
- Coauthor
Mr. Juan Carlos Antolin, INASMET-TECNALIA, Spain
- Coauthor
Mr. Félix Lamela, EADS CASA Espacio, Spain
- Year
2006
- Abstract
This abstract summarizes the work performed within the frame of the Advanced Equipment Design (AED) project, ESA Contract 16725/02/NL/CK.
The AED mini-project study has comprised four sub activities:
- Lightweight housings for equipment units.
- Improved design of large compact equipment assemblies.
- Multifunctional support panels for electronic equipment
- Lightweight electronic boxes for SAR antennas
The four sub activities are based in a common technological trend directed to improve electronic equipments housing and structures support by using lightweight alloys and composites and by producing more integrated designs, which demands to use high thermal dissipative materials. By means of this technology considerable volume and mass reductions can be achieved.
The goal of the sub-activity c) was to develop a multifunctional structure where structural, thermal and electrical functions are integrated. The Bread Board Model focuses on a mini-satellite spacecraft bus structure and has the PROTEUS bus as a reference application.
The structure is based on lightweight composite panels of 500*280 mm2 dimensions. To keep the doubler-associated mass increase as low as possible, the use of high thermal conductivity CFRP is a suited solution. These fibers are combined with mechanical resistance effective layers.
The implementation of the MFS concept and its performance under representative environmental loading has been assessed to demonstrate the robustness of this system. The Multifunctional Support Panel Bread Board Model (MFSP BBM) has been equipped with a “dummy” electrical functionality that serves to demonstrate experimentally the performance of the multifunctional panels from the functional, mechanical, thermal and shielding point of view. Detailed analysis including FEM analysis, manufacturing and component level tests have been performed within the frame of this sub-activity.
It can be concluded that the MFS (MultiFunctional Structures) technology has been applied and proved successfully. It is confirmed that important mass and volume savings can be obtained applying this technology.
- Abstract document
- Manuscript document
IAC-06-C2.8.10.pdf (🔒 authorized access only).
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