An Investigation on Thermal Modeling and Heat Load Mitigation for Satellite Electronic Components
- Paper number
IAC-06-D1.P.1.09
- Author
Mr. Mehran Shahryari, ITRC, Iran
- Year
2006
- Abstract
Since most of the satellite components are using various EEE (Electrical, Electronic and Electromechanical) parts, the reliability of EEE parts act very important in the satellite system. There are many factors that influence the reliability of EEE parts in the satellite system. Excessively dissipated heat can cause the failure of EEE parts and consequently, leading to a failure of total satellite system. In this paper, the thermal modeling using nodal network was compared with that using CVDM (Control Volume Discrete Method) to find out which one is the most suitable methodology. For a comparison purpose , a small communication satellite was modeled by two different modeling and the results were discussed. There was almost no difference in the numerical results between the two modeling methods. However, while it took much more time to perform thermal analysis using the CVDM modeling method, and the debugging was more difficult in the CVDM when the error was occurred. The computation time was considerably reduced by developing and implementing the input file format transfer code when using nodal network modeling method. It was found that the nodal network modeling method is suitable for the complicated devices, such as satellites or transponders, because of its simple debugging ability. Excessive heat load was expected on some EEE parts of satellite such as high heat-dissipated diodes, transistors, and inductors due to an increase power demand of the satellite systems. The methods for the mitigation of heat load were studied through the design optimization of housing or the layout change of high power parts
- Abstract document