Multichip modules of 3-d assembling on unpacked VLSI for on-board space radioelectronic systems
- Paper number
IAC-06-D1.P.2.02
- Author
Dr. Genady Blinov, Roscosmos, Russia
- Coauthor
Dr. Aleksander Grushevski, Roscosmos, Russia
- Coauthor
Dr. Aleksander Kotov, Roscosmos, Russia
- Year
2006
- Abstract
The purpose of this paper is great lower dimensions and mass of electronic modules, used in on-board space systems, higher integration and reliability, including radiation resistance as well as higher speed. The methodology of the paper is a complex decision to create integrated multichip modules, including specialized VLSI on flexible microminiature polyimide bearers with aluminium leads instead of mass/volume package, compact highly reliable methods of such VLSI 3-d assembling on multilayer switching boards on the basis of polyimide layer and flexible precise double-sided polyimide loops. This paper presents structural and technological principles and results of their realization in developing small-size multichip electronic modules for on-board radio-electronic systems using unpacked VLSI and flexible polyimide bearers. Flexible polyimide bearers are used for integration of VLSI chips and their testing, validation and further microassembling onto multilayer 3-d switching boards as well as for creation of flexible precise loops and multilayer switching boards with beam leads. VSLI integration and assembling onto the switching board are carried out on 3-d assembling principles. Due to flexible switching boards the module can reduce in three dimensions and form into a complex 3-d configuration. And with a flexible precise loop used at the same time, electronic modules can be laid out in the most hard-to-reach places of on-board systems. While developing polyimide bearers for VLSI integration and validation aluminium conductors and beam leads are used to provide more efficiently their automated integration on the chip and more reliable joins due to ultrasonic bonding of bearer and chip leads made of homogenous materials. While developing switching boards on the polyimide layer plasmochemical etching of holes with 40-50 micrometer in diameter are used for crossover joints with a 0,25 millimeter pitch. Copper conductors based on semiadditive technology together with magnetron application with a 100 micrometer pitch and a 20 micrometer depth are also used on well as fleux-free soldering in vacuum for multilayer joints. The paper presents efficient solutions for providing heat sink from chip and jam-protection of projected electronic modules. Finally there are conclusions and integrated solutions relating to radio-electronic blocks of on-board space systems using multichip modules described, for inotance, a multichip memory card holding 84 VLSI chip, heat high speed information handling module with over 10 watt chip heat generation in the static mode. These structural and technological solutions allow to reduce 3-5 times. The mass and dimensions of on-board electronic blocks, to increase speed and reliability of electronic device. The material, presented in the paper, is new and patent. It was not presented at a prevision meeting. The poster presentation is preferred. Financing and attendance of the authors is assured.
- Abstract document
- Manuscript document
IAC-06-D1.P.2.02.pdf (🔒 authorized access only).
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