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  • Manufacturing cost and lead time calculation applied to highly miniaturized systems for space

    Paper number

    IAC-06-E2.1.02

    Author

    Mrs. Theres Gustafsson, Angstrom Aerospace Corporation (AAC), Sweden

    Coauthor

    Dr. Greger Thornell, Sweden

    Year

    2006

    Abstract
    Microelectromechanical Systems (MEMS) are the embodiment of the sophisticated, diverse, fertile and multidisciplinary technologies stemming from microelectronics miniaturization. Potentially, this miniaturization increases the performance of spacecraft and enables new applications in space. Taken to its extreme, it allows for entirely miniaturized spacecraft which require a less costly launch, probably find an earlier time slot and are put to service earlier. Tactical rapid responsive systems, such as low weight Earth Observation satellites are a lucrative application example. However, this implies large manufacturing volumes and efficient processing, and hence necessitates a better understanding of MEMS process complexity. This is particularly important when adding design demanding and cost driving requirements, as those on vibration, radiation, and long term stability and reliability. 
    MEMS fabrication differs from other types of fabrication in terms of the numerous processes involved, and their great variety. A component may involve several hundreds of operations. This partly explains the difficulty of planning and controlling the manufacturing, especially in terms of costs and lead times. Equally important, and related, is the yield that quickly decreases with the number of sequential steps and the degree of miniaturization. The fact that components with features far below 1 mm in size cannot be readily, if at all, repaired or even replaced, should not be ignored in this context.
    Within this work, a model to estimate costs and lead times for integrated MEMS is being developed and evaluated. It takes critical parameters, such as process and equipment capacity, operating costs, need for labor attendance, batch sizes, etc., into account, and is applicable both to in-house production and outsourced fabrication, both on sites with a low or medium level of occupation.  
    The model can be used when designing the components to predict the effects of choosing certain processes in terms of time and cost. Hence, it offers possibilities to adjust the design and the process scheme to decrease cost and manufacturing time, or at least balance these. Its flexibility makes it useful in both prototyping and full-scale production. 
    MEMS technology has not yet penetrated the space field in a broad sense, due both to its youth and the spaceflight heritage requirement. Hopefully, this model will help relieve the “Catch 22”, where many MEMS components get stuck in the Technology Readiness Level (TRL) valley of death, i.e. the paradox of components not being allowed to fly in space as they haven’t been flown. By simplifying the control of MEMS fabrication and so render transparency to the technology, employing microcomponents and microsystems in space missions will become more attractive to space companies and space agencies. 
    
    Abstract document

    IAC-06-E2.1.02.pdf

    Manuscript document

    IAC-06-E2.1.02.pdf (🔒 authorized access only).

    To get the manuscript, please contact IAF Secretariat.