Paper information
- Paper code
- Room
IP Area
- Title
OPTIMIZING SPACECRAFT ELECTRONICS: OVERCOMING PCB THERMAL MODELING CHALLENGES
- abstract
- Session
IP. Interactive Presentations - IAF MATERIALS AND STRUCTURES SYMPOSIUM
- symposium
C2. IAF MATERIALS AND STRUCTURES SYMPOSIUM
- congress
IAC-25
- Type of presentation
interactive
Ms. Prapty Majumder Golpa, BRAC University, Bangladesh
