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    Paper code

    IAC-17,C2,IP,16,x38130

    Date

    2017-09-28

    Time

    12:45

    Order

    16

    Room

    Hall J&K2

    Title

    The Research of the Integrated Compound Insulator’s Strain Field Measurement under Bending Deformation based on Digital Image Correlation Method

    abstract

    View PDF

    Session

    IP. Interactive Presentations

    symposium

    C2. MATERIALS AND STRUCTURES SYMPOSIUM

    congress

    IAC-17

    Type of presentation

    interactive

    Main author

    Mr. Qiang Xiong, Beijing Aerospace Technology Institute, China