Paper #38130

Paper information

Paper code: IAC-17,C2,IP,16,x38130
Order: 16
Room: Hall J&K2
Title: The Research of the Integrated Compound Insulator’s Strain Field Measurement under Bending Deformation based on Digital Image Correlation Method
abstract: View PDF
Session: IP. Interactive Presentations
symposium: C2. MATERIALS AND STRUCTURES SYMPOSIUM
congress: IAC-17
Type of presentation: interactive