Miniaturized Onboard System Components
- Paper number
IAC-07-B4.7.03
- Author
Mr. Peter Nilsson, Angstrom Aerospace Corporation (AAC), Sweden
- Coauthor
Dr. Fredrik Bruhn, Angstrom Aerospace Corporation (AAC), Sweden
- Coauthor
Mr. Robert Thorslund, Angstrom Aerospace Corporation (AAC), Sweden
- Year
2007
- Abstract
Ångström Aerospace Corporation has developed a set of onboard system components, based on advanced Multi-Chip Module (MCM) packaging methods using microsystems technology. The components presented includes a mass memory module and a multipurpose remote terminal unit (RTU). The RTU can interface to sensors and elementary protocols and provide the user with processing capabilities in microprocessor and programmable logic. The unit comprises standardized space protocols such as controller area network (CAN) and redundant spacewire, with a possibility to add other using the user customization feature. A mass memory module has been developed, where 3-D packaging is used to achieve a very high packing density in a low mass. The memory module is initially coupled with a proven controller from Saab Space. The two miniaturized units will form an integral part in the MicroLink nanosatellite concept, where a complete spacecraft with high functionality is created through modules of standardized microsystems. The modules in development can be used in nano and microsatellites for onboard data collection and storage, in a distributed or centralized system. Distributed processing and data storage can give secondary mass reductions in data transfer requirements, harness mass and power consumption. The components are planned for flight tests in 2008.
- Abstract document
- Manuscript document
IAC-07-B4.7.03.pdf (🔒 authorized access only).
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