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  • IAC-11
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  • session 7
  • 7. Space Vehicles – Mechanical/Thermal/Fluidic Systems

    Papers

    1. A new methodology for estimating surface heat flux from in-depth sensors

    2. Carbon/carbon comparative optimization method for hot structures applications in re-entry environment conditions

    3. Active thermal control system for perspective venusian lander

    4. A Thermal Model for Analysis and Control of Drilling in Icy Formations on Mars

    5. Egse in spacecraft thermal vacuum tests for accurate power measurements and minimization of power supplies

    6. Application of inertia relief in structural strength analysis of reusable launch vehicle

    7. RE-USE OF EXOMARS ROVER ON ICY MOONS OF JUPITER

    8. Versions of orbiters’ flight systems for nonnuclear action on asteroid Apophis

    9. Spacecraft Aerodynamics and Heat Shield Characteristics Impact on Optimal Aeroassisted Coplanar Orbital Transfer

    10. Thermal buckling of simply supported moderately thick functionally graded plates

    11. Research on Flight experiment Technique to Verification Thermal Protection Materials and Insulation Materials

    12. Application of Structured Singular Value Method to Aeroservoelastic Robustic Stability Analysis for Reusable Launch Vehicle

    13. Flow-Structure-Thermal Investigation of Blunt Body in High-Enthalpy Flows

    14. Topological structures and aerodynamic characteristic analysis of hypersonic flow over HTV-type aircraft

    15. Estimation of crack growth behavior in welded space vehicles structural components

    16. NUMERICAL SOLUTION OF STEADY VISCOUS FLOW AND HEAT TRANSFER PAST GAS BUBBLES IN A SPACECRAFT HEATPIPE

    17. Aerothermal computation research for re-entry vehicles in real gas effect

    18. Research on 3d cavity flow and its aero-optics phenomena

    19. The numerical study of cone-derived waverider with nonuniform blunt radius

    20. Cork filled ethylene-propylene-diene monomer based thermal insulation for space vehicles

    21. Hypersonic surface heating computation on blunt bodies

    22. Effect of epoxy adhesive on solder joint reliability of 3D Plus SRAM under thermal cycling