Effect of epoxy adhesive on solder joint reliability of 3D Plus SRAM under thermal cycling
- Paper number
IAC-11,C2,7,22,x9528
- Author
Mr. Dai Feng, CAST, China
- Year
2011
- Abstract
3D Plus SRAM(Static Random Access Memory) is a high density electronic component and is with the standard small outline package (SOP) created by three-dimensional stack technology .In order to improve its shock and vibration reliability the epoxy adhesive is generally used to reinforce the SRAM. However, it will reduce the solder joint reliability because of the thermal mismatch between the lead wire of SRAM and the adhesive. This paper researches the effects of epoxy adhesive on the solder joint reliability of SRAM under thermal cycling using both experimental and finite element methods (FEM).The FEM and experimental results explain how the adhesive negatively affects the solder reliability of SRAM. Moreover, a numerical parametric study was carried out by the FEM. The results show that the solder joint reliability of SRAM strongly depends on the thermal expansion coefficients and the amounts of the adhesive. Based on these results, how to choice and use a fit epoxy adhesive for the SRAM solder joint reliability under thermal cycling is presented.
- Abstract document
- Manuscript document
IAC-11,C2,7,22,x9528.pdf (🔒 authorized access only).
To get the manuscript, please contact IAF Secretariat.